With services ranging from advanced process development to standard production CMP services, Axus Technology is equipped to provide customers with the precise process and development services they need.  With a fully equipped Class 100 cleanroom staffed by engineers with decades of semiconductor process experience, the Axus Technology team can process your small or large lots of production substrates, develop and combine custom thinning and planarization processes, and provide you with the rapid and economical results that you need.

Standard Process Services Include:

• Chemical Mechanical Planarization
• Wafer Grinding
• Substrate Polishing
• Substrate Cleaning
• Wafer Bonding, Temporary & Perm.
• Metal Surface Grinding & Polishing
• TSV and Advanced Packaging
• Consumables Qualification

We specialize in foundry and process services such as:

• CMP               • Bonding
• Polishing        • Wafer Grinding
• Thinning         • Edge Grinding
• Wafer/            • Edge Trim
  Substrate Cleaning

Click here for more information.

• See Axus at the upcoming IMAPS Device Packaging Conference, March 12-13, Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, Arizona, booth # 16.

• Axus recently presented "Process Optimization of Grinding and CMP for Thinning of SI" at the International Conference on Planarization/CMP Technology in Grenoble, France. Click here to view the presentation

• Paul Feeney from Axus Technology presenting “Back to the Future of CMP Non-uniformity” at the US CMP Users Group Seminar during Semicon in July 2012. Click here to view the presentation.

• Axus recently presented at the 28th CMP Users Group Meeting in Leuven, Belgium on Friday April 13. Click here to view the presentation.