Your source for leading-edge surface processing solutions

Axus Technology delivers leading-edge CMP, wafer thinning and wafer polishing solutions for semiconductor, MEMS/Nanofabrication, nanofabrication and substrate applications. Axus Technology is the industry expert in providing material processing and CMP foundry services, process tools, and custom configured upgrades that are designed to meet your process and production requirements.  

Customer support services include tool upgrades, robot repair , spare parts, and field service support for a range of CMP and wafer grinding tools, including installed legacy tools. Engineering services include process development, equipment modification and upgrade, and the value engineering of critical components.  Axus also manages surplus equipment transactions and the remarketing of excess spares and materials.  If it involves technical support for polish, grind or planarization, the engineers at Axus Technology have the experience to deliver results.

News

Presentation at International Conference on Planarization Technology, November 19 – 21, 2014, Kobe, Japan

Presentation at CAMP Conference Outlines Changes in CMP Ecosystem

Upcoming Events

IMAPS Device Packaging Conference - March 16-19, 2015 - Radisson Fort McDowell Resort and CasinoScottsdale/Fountain Hills, Arizona