With services ranging from advanced process development to standard production CMP services, Axus Technology is equipped to provide customers with the precise process and development services they need.  With a fully equipped Class 100 cleanroom staffed by engineers with decades of semiconductor process experience, the Axus Technology team can process your small or large lots of production substrates, develop and combine custom thinning and planarization processes, and provide you with the rapid and economical results that you need.

Standard Process Services Include:

• Chemical Mechanical Planarization
• Wafer Grinding
• Substrate Polishing
• Substrate Cleaning
• Wafer Bonding, Temporary & Perm.
• Metal Surface Grinding & Polishing
• TSV and Advanced Packaging
• Consumables Qualification

We specialize in foundry and process services such as:

• CMP               • Bonding
• Polishing        • Wafer Grinding
• Thinning         • Edge Grinding
• Wafer/Substrate Cleaning

Click here for more information.

• Axus recently presented at the 28th CMP Users Group Meeting in Leuven, Belgium on Friday April 13. Click here to view the presentation.

• Axus was a proud sponsor of ICPT 2011 which was held in Seoul, Korea November 9 - 11, 2011 For more details about the conference, see the article by Paul Feeney, Axus' Director of Process Technology and a member of the executive committee for ICPT.

• Read the material Axus presented at the 2010 ICPT Conference in November 2010.