IPEC 372M AUTOMATED CMP TOOL

The IPEC 372M wafer polisher is a fully automated, precision tool for CMP polishing of semiconductor wafers used to achieve flatness, uniformity and planarization on patterned/device wafers. The 372M features automatic wafer handling and is capable of two platen, two-step polishing processing to maximize wafer throughput capability and quality. Designed to planarize wafers from 100mm to 200mm, the 472 is ideally suited for materials polishing applications that require repeatability with operational and processing flexibility. Only Axus Technology is authorized to provide ViPRR carrier upgrades for refurbished IPEC 372M and 472 CMP tools. The IPEC 372M supports a number of conditioner and carrier upgrades.

Standard Features Include

  • Automated control with soft touch keypad
  • Two-platen process for post polish buff
  • Multiple slurry dispense
  • In-situ pad conditioner
  • Material compatibility for medium and low ph slurries (1 – 12)
  • Down force up to 750lbs.
  • Controllable wafer backpressure
  • Polish head clean station
  • External interface for end point capability

Optional Features

  • Multizone ViPRR carrier upgrade
  • Temperature controlled platens
  • SECS II Interface

For more information about contract refurbishment services, refurbished tools from Axus Technology, or field service for IPEC tools, please contact either Tim St. Marie or Barrie VanDevender at our Chandler, AZ facility.

Contact Axus Technology or your local Axus Technology Sales Representative to discuss how Axus can help you get the most from your equipment investment.


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