Axus Technology maintains an inventory of high quality new, used and refurbished process equipment. Standard specifications for these systems are provided below. We also specialize in providing engineering modifications and enhancements to these systems. This capability enables us to configure these systems for unique or non-standard applications, which may result in changes or improvements to these specifications. Please contact us to discuss your specific requirements.

Please contact Axus Technology to discuss your equipment needs or equipment parts.

Specifications:

• Fully automated, single wafer polisher designed to accommodate 100mm to 200mm wafers
• Features automatic wafer loading / unloading, and is capable of two-step polishing processing to maximize wafer processing capability and quality
• Includes APP1000 advanced pad profiler pad conditioner

Suitable for:

• CMP processing of oxide and other dielectrics, tungsten and copper
• Silicon and SOI polishing
• MEMS processing
• R&D and high volume manufacturing

Options available include endpoint detection, integrated metrology, and cleaning.

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