Axus Technology maintains an inventory of high quality new, used and refurbished process equipment. Standard specifications for these systems are provided below. We also specialize in providing engineering modifications and enhancements to these systems. This capability enables us to configure these systems for unique or non-standard applications, which may result in changes or improvements to these specifications. Please contact us to discuss your specific requirements.

Please contact Axus Technology to discuss your equipment needs or equipment parts.

Specifications:

• Fully automated grinder designed for high throughput, high precision wafer grinding
• Designed for 3 inch to 150mm wafers
• Incorporates high precision, low stress vertical in-feed grinding method, suitable for both typical semiconductor materials and more fragile materials
• Capable of performing both single and two-step grinding processes at high throughput

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