Axus: IPEC 676 Automated CMP Tool

IPEC 676 AUTOMATED CMP TOOL

The IPEC 676 automated CMP system is capable of throughput of 40 or more wafers per hour and offers one of the industry’s smallest footprints. The 676 can be used to polish either oxide or metal layers, allowing customers to reduce the number of different CMP systems in a wafer fabrication facility. The 676 is designed to improve yields by use of an orbital polishing motion rather than conventional rotational CMP techniques to enable higher levels of reliability and ease of use.

Standard Features Include:

Four wafer planarizers
Three cassette tilter load/unload station
Advanced pad motion control
High speed polish drive (0-600 RPM)
Closed loop delta P control
Endpoint detection system
Stainless steel polish bell
Dual pad conditioning systems
Upgraded 500MHz Pentium

For more information about contract refurbishment services, refurbished tools from Axus Technology, or field service for IPEC tools, please contact either Tim St. Marie or Barrie VanDevender at our Chandler, AZ facility.

Contact Axus Technology or your local Axus Technology Sales Representative to discuss how Axus can help you get the most from your equipment investment.

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