Features:

• High throughput option increases production up to 30%
• Dual polishing spindles for 100-200mm wafers
• Hydrolift Load Station improves edge exclusion
• Dual spindle design provides for both single and double wafer processing, providing a significant throughput advantage
• Two table design enables multi- step process capability
• Proven process performance for oxides, tungsten and STI applications
• Pad conditioning system provides in-situ and/or ex-situ programmable selective pad conditioning for consistent removal rates and minimum non-uniformity. 20 zones of programmable control: dwell time, downforce and RPM can be programmed for each zone. Pad conditioning can be done with a diamond plated disk or nylon brush

For more information about contract refurbishment services, refurbished tools from Axus Technology, or field service for IPEC tools, please contact either Tim St. Marie or Barrie VanDevender at our Chandler, AZ facility.

Contact Axus Technology or your local Axus Technology Sales Representative to discuss how Axus can help you get the most from your equipment investment.

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