| Technology
trends create the opportunity to use new and often challenging
materials that provide improved device performance. With
our experience in developing or modifying equipment and/or
processes to meet the challenges involved with exotic materials
processing, we have successfully addressed such new material
processes. Some examples of the types of materials
and processes addressed include: Grinding of gallium arsenide
wafers with and without bonded carrier substrates.
 |
Grinding of gallium arsenide wafers with and without
bonded carrier substrates. |
|
Grinding and polishing
of nickel-cadmium-telluride wafers used in manufacturing
high resolution displays. |
|
Grinding and polishing of sapphire
wafers. |
|
CMP of polyimide on ceramic
substrates for manufacturing thermal conduction module
systems for use in supercomputers. |
Please consult with
us to discuss your needs and our capabilities related to
grinding, polishing and post process cleaning processes
for exotic or unique materials.
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