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Many of
the characteristics and requirements for producing MEMS
(microelectronic machined structures) devices are directly
related to the types of technologies in which we specialize.
As the number of applications and required technology solutions
for this market continues to grow, Axus Technology is uniquely
positioned to deliver critical solutions to meet these
demands. The types of solutions we offer for MEMS applications
are explained below.
CMP/Planarization
MEMS
devices often require the use of CMP for critical material
removal or planarization of thin film layers applied in
device manufacturing. Based on extensive CMP process and
equipment engineering expertise Axus Technology can develop
and demonstrate new or existing processes to meet these
requirements. Axus Technology can also help to define the
exact hardware needed for a MEMS process, and either source
or modify the equipment as required.
Grinding Grinding processes are often used for applications involving
bonded or hybrid substrates. Other uses include backgrinding
to meet final wafer/device thickness criteria, which
may involve traditional semiconductor packaging requirements
or unique technologies to meet specific package designs
and environmental requirements for some MEMS applications.
Grinding is a cost effective technique suitable for
meeting requirements related to bulk material removal
with precise control of remaining or removed material
thickness, flatness and surface finish. Grinding
processes can also be combined with other processing
steps such as polishing and wafer thinning as required
to produce optimum results (see Wafer Thinning section
below).
Wafer Thinning
Wafer thinning is a process used or required by several
emerging technologies, including MEMS, smart card
manufacture, and advanced semiconductor packaging.
Wafer thinning processes provide for efficient bulk
material removal using advanced grinding techniques,
as well as control of material thickness, flatness
and surface finish. This can be coupled with or substituted
with a polish process that can provide precise control
of material removal and surface finish characteristics.
Post
Process Cleaning
Post process cleaning solutions include double-sided
scrubbing, spin/rinse/dry, and chemical cleaning
technologies. Axus Technology can provide users with
process support, development or system modifications.
This ranges from simply finding an effective cleaning
recipe to implementing systems modifications necessary
for supporting new processes.
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