With semiconductor
process experience dating back to the early 80s, the expertise
of Axus Technology encompasses virtually all semiconductor
processes and applications.
Semiconductor Chemical Mechanical Planarization (CMP)
The CMP processes that are directly supported include
dielectric layer, and tungsten polish, as well as copper
and low-K material. The principals of Axus Technology
have been intimately involved with the development of
processes and tooling since the initial development of
CMP technology and continuing right up through current
high volume production tools.
Silicon Wafer Manufacturing and Wafer Reclaim
Axus Technology
offers solutions for most applications related to the
manufacturing and processing of wafers and substrates.
These applications include specialized manufacturing
of unique or low-volume substrate geometries and materials.
Processes related to these applications include front
and backside wafer polishing, wafer backgrinding, and
edge profile grinding and polishing.
Semiconductor Packaging
We provide tools and processes for use in semiconductor
packaging operations. Axus Technology offers advanced,
efficient, and reliable technologies that meet the technical
and cost requirements of packaging specialists. Technical
solutions for packaging include wafer backgrinding, wafer
thinning, and polishing.
Post Process Cleaning
Post process cleaning solutions include double-sided
scrubbing, spin/rinse/dry, and chemical cleaning technologies.
Axus Technology can provide users with process support,
development or system modifications. These range from
simply finding an effective cleaning recipe to implementing
systems modifications necessary for supporting new processes.
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