Equipment to be Used for Nano Technology and Advanced Semiconductor Research
Chandler, AZ – July 08, 2004 – Axus Technology, a global provider of semiconductor manufacturing equipment, parts, and engineering services for chemical mechanical planarization (CMP), wafer cleaning and wafer-thinning equipment users, today announced the delivery of CMP tools sets to two leading university labs. Both the University of Michigan Solid State Electronics Lab and the University of Arizona Microelectronics Laboratory selected Axus Technology for installation of CMP tools and related post-CMP cleaning tools.
“Axus Technology demonstrated the in-depth understanding of CMP processes necessary to support our nano-technology programs and was able to configure equipment to meet our particular requirements,” said Tim Brock, a senior research associate at the University of Michigan. “Axus also completely remanufactured the tools, providing us with leading-edge capability for much less than new equipment would have cost.” The University of Michigan will use the equipment provided by Axus Technology in a variety of research projects focused on nano technology. Projects are pursued and funded in partnership with corporate sponsors.
The University of Arizona installed additional CMP and cleaning tools provided by Axus Technology in its Tucson Microelectronics Lab, to supplement its existing CMP technology. “Axus Technology had been supporting our equipment and was able to provide our lab with the additional CMP tools necessary for expanding our efforts in planarization research,” said Dr. Victor Wells, the recently retired microelectronics lab manager. “We know we can count on Axus for quality equipment, parts and service.”
Axus Technology Vice President of Engineering Dan Trojan said, “We’re proud that many renowned university, industrial and government labs turn to us for a wide range of reliable equipment and support for their unique surface processing needs. These users help us in developing new product concepts and in increasing the productive life of legacy tools.”
The University of Michigan Solid State Electronics Lab in Ann Arbor is dedicated to facilitating research in all aspects of compound semiconductor and silicon microelectronics, micromachined devices, integrated circuits, microsystems, microfabrication technologies and semiconductor process control and manufacturing. For more information, visit: http://www.eecs.umich.edu/ssel/ .
The University of Arizona Microelectronics Laboratory is actively involved in research related to semiconductor processing, MEMS/Nanofabrication research, advanced packaging technology, and environmentally benign cleaning technologies. For details, visit: http://www.ece.arizona.edu.