This unit features two-spindle, three-rotary-chuck table specifications, allowing high-quality ultra-thin grinding for thin wafers 3D integration, bonded wafers, etc.

Axus Technology maintains an inventory of high quality new, used and refurbished process equipment. Standard specifications for these systems are provided below. We also specialize in providing engineering modifications and enhancements to these systems. This capability enables us to configure these systems for unique or non-standard applications, which may result in changes or improvements to these specifications. Please contact us to discuss your specific requirements.

Please contact Axus Technology to discuss your equipment needs or equipment parts.

 

 

Return to Axus Equipment Page