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Axus Technology
7001 W. Erie St.
Suite 1
Chandler, AZ 85226
480-705-8000 |
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| Strasbaugh
Model 7AF Wafer Grinder/Backgrinder |
Axus Technology maintains
an inventory of high quality new, used and refurbished
process equipment. Standard specifications for these
systems are provided below. We also specialize in providing
engineering modifications and enhancements to these systems.
This capability enables us to configure these systems
for unique or non-standard applications, which may result
in changes or improvements to these specifications. Please
contact us to discuss your specific requirements.
Specifications:
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Fully automated grinder designed
for high throughput, high precision wafer grinding |
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Designed for 100 to 200 mm wafers |
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Incorporates high precision, low stress
vertical in-feed grinding method, suitable for both typical
semiconductor materials and more fragile materials |
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Capable of performing both single and
two-step grinding processes at high throughput |
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In-situ digital probes for real time wafer
thickness measurement and control |
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