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Axus Technology
7001 W. Erie St.
Suite 1
Chandler, AZ 85226
480-705-8000 |
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| Disco
Model DFG841 System |
Axus Technology maintains
an inventory of high quality new, used and refurbished
process equipment. Standard specifications for these
systems are provided below. We also specialize in providing
engineering modifications and enhancements to these systems.
This capability enables us to configure these systems
for unique or non-standard applications, which may result
in changes or improvements to these specifications. Please
contact us to discuss your specific requirements.
Specifications:
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The DFG841
is a fully automatic in-feed grinder for thinning wafers
in a batch process. |
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Two-spindle, two-chuck
table specifications and a robot arm with a same-cassette
return function. |
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The robot arm vacuum
ensures that even thin ground wafers, which are prone
to warping, are corrected to the required flatness for
trouble free handling. |
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Suitable for: |
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- Silicon, Gallium Arsenide and Lithium
Tantalite wafers
- Front side planization - Wafer manufacturer market
- Backside grinding - Device manufacturer market
- Backside grinding - Research, small lot grinding
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