Technology trends create the opportunity to use new and often challenging materials that provide improved device performance. With our experience in developing or modifying equipment and / or processes to meet the challenges involved with exotic materials processing, we have successfully addressed such new material processes.

Some examples of the types of materials and processes addressed include: Grinding of gallium arsenide wafers with and without bonded carrier substrates.

• Grinding of gallium arsenide wafers with and without bonded carrier substrates.
• Grinding and polishing of nickel-cadmium-telluride wafers used in manufacturing high resolution displays.
• Grinding and polishing of sapphire wafers.
• CMP of polyimide on ceramic substrates for manufacturing thermal conduction module systems for use in supercomputers.

Please consult with us to discuss your needs and our capabilities related to grinding, polishing and post process cleaning processes for exotic or unique materials.