With services ranging from advanced process development to standard production CMP services, Axus Technology is equipped to provide customers with the precise process and development services they need.  With a fully equipped Class 100 cleanroom staffed by engineers with decades of semiconductor process experience, the Axus Technology team can process your small or large lots of production substrates, develop and combine custom thinning and planarization processes, and provide you with the rapid and economical results that you need.

Standard Process Services Include:

• Chemical Mechanical Planarization
• Wafer Grinding
• Substrate Polishing
• Substrate Cleaning
• Wafer Bonding, Temporary & Perm.
• Metal Surface Grinding & Polishing
• TSV and Advanced Packaging
• Consumables Qualification

Semiconductor

With semiconductor process experience dating back to the early 80s, the expertise of Axus Technology encompasses virtually all semiconductor processes and applications.

MEMS Processing

As the number of applications and required technology solutions for this market continues to grow, Axus Technology is uniquely positioned to deliver critical solutions to meet these demands.

Exotic Materials

Technology trends create the opportunity to use new and often challenging materials that provide improved device performance.