CMP | Grinding | Wafer Thinning | Post Process Cleaning

Many of the characteristics and requirements for producing MEMS (microelectronic machined structures) devices are directly related to the types of technologies in which we specialize. As the number of applications and required technology solutions for this market continues to grow, Axus Technology is uniquely positioned to deliver critical solutions to meet these demands. The types of solutions we offer for MEMS applications are explained below.

MEMS devices often require the use of CMP for critical material removal or planarization of thin film layers applied in device manufacturing. Based on extensive CMP process and equipment engineering expertise Axus Technology can develop and demonstrate new or existing processes to meet these requirements. Axus Technology can also help to define the exact hardware needed for a MEMS process, and either source or modify the equipment as required.

Grinding processes are often used for applications involving bonded or hybrid substrates. Other uses include backgrinding to meet final wafer/device thickness criteria, which may involve traditional semiconductor packaging requirements or unique technologies to meet specific package designs and environmental requirements for some MEMS applications. Grinding is a cost effective technique suitable for meeting requirements related to bulk material removal with precise control of remaining or removed material thickness, flatness and surface finish. Grinding processes can also be combined with other processing steps such as polishing and wafer thinning as required to produce optimum results (see Wafer Thinning section below).

Wafer thinning is a process used or required by several emerging technologies, including MEMS, smart card manufacture, and advanced semiconductor packaging. Wafer thinning processes provide for efficient bulk material removal using advanced grinding techniques, as well as control of material thickness, flatness and surface finish. This can be coupled with or substituted with a polish process that can provide precise control of material removal and surface finish characteristics.

Post process cleaning solutions include double-sided scrubbing, spin / rinse / dry, and chemical cleaning technologies. Axus Technology can provide users with process support, development or system modifications. This ranges from simply finding an effective cleaning recipe to implementing systems modifications necessary for supporting new processes.

Please consult with us to discuss your needs and our capabilities related to MEMS processing services.