CMP | Silicon Wafer Mfg & Wafer Reclaim | Semiconductor Packaging | Post Process Cleaning

With semiconductor process experience dating back to the early 1980s, the expertise of Axus Technology encompasses virtually all semiconductor processes and applications.

The CMP processes that are directly supported include dielectric layer, and tungsten polish, as well as copper and low-K material. The principals of Axus Technology have been intimately involved with the development of processes and tooling since the initial development of CMP technology and continuing right up through current high volume production tools.

Axus Technology offers solutions for most applications related to the manufacturing and processing of wafers and substrates. These applications include specialized manufacturing of unique or low-volume substrate geometries and materials. Processes related to these applications include front and backside wafer polishing, wafer backgrinding, and edge profile grinding and polishing.

We provide tools and processes for use in semiconductor packaging operations. Axus Technology offers advanced, efficient, and reliable technologies that meet the technical and cost requirements of packaging specialists. Technical solutions for packaging include wafer backgrinding, wafer thinning, and polishing.

Post process cleaning solutions include double-sided scrubbing, spin / rinse / dry, and chemical cleaning technologies. Axus Technology can provide users with process support, development or system modifications. These range from simply finding an effective cleaning recipe to implementing systems modifications necessary for supporting new processes.

Please consult with us to discuss your needs and our capabilities related to semiconductor services.